Wafer Bonding: Applications and Technology (2004) (Springer Series in Materials Science #75)
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- Synopsis
- The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
- Copyright:
- 2004
Book Details
- Book Quality:
- Publisher Quality
- ISBN-13:
- 9783662108277
- Related ISBNs:
- 9783540210498
- Publisher:
- Springer Berlin Heidelberg
- Date of Addition:
- 08/25/22
- Copyrighted By:
- N/A
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Science, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
- Edited by:
- Marin Alexe
- Edited by:
- Ulrich Gösele